Sequential burn-in test mechanism

摘要

A method includes performing a burn-in test on an integrated circuit (IC) by removing power from a first component block within the IC and applying a maximum burn-in voltage and temperature to a second component block within the IC.

主权项

1. An integrated circuit (IC) comprising:
a first component block; a second component block; and a power control unit (PCU) coupled to the first and second component blocks to perform a burn-in test of the IC by removing power from the second component block and applying a maximum burn-in voltage and temperature to the first component block, wherein performing the burn-in test of the IC further comprises removing power from the first component block and applying the maximum burn-in voltage and temperature to the second component block; a first gate transistor coupled between the first component block and the PCU; and a second gate transistor coupled between the second component block and the PCU.