Element mounting substrate and semiconductor module

摘要

Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

主权项

1. An element mounting substrate comprising:
at least three metal core substrates arranged in parallel with, but not stacked, each other; and insulating resin embedded among the metal core substrates, each metal core substrate including:
a metal core mainly composed of metal;a first ceramic film formed on one main surface of the metal core;a second ceramic film formed on the other main surface of the metal core;a first insulating resin film formed on a surface of the first ceramic film; anda second insulating resin film formed on a surface of the second ceramic film, wherein the insulating resin between two metal core substrates adjacent to each other does not extend from one side of the element mounting substrate to an opposing side, and another metal core substrate is arranged between the one side and the opposing side so that the insulating resin is blocked by the another metal core substrate.