Electrochemical device

摘要

[Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card.;[Solution] In the electrochemical device RB1, the main body of the package PA includes first cover plate 15, first terminal plate 12, frame plate 14, second terminal plate 13, and second cover plate 16 stacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates 15, 16, by the through holes 12a1, 13a1 in the frame sections 12a, 13a of the terminal plates 12, 13 and the through hole 14a in the frame plate 14.

主权项

1. An electrochemical device having an electric storage element encapsulated in a package, the package comprising:
(1) a first terminal plate comprising: a frame section having a through hole formed therein; and a terminal section integrated with the frame section and protruding externally from the frame section; (2) a second terminal plate comprising: a frame section having a through hole formed therein; and a terminal section integrated with the frame section, disposed at a position different from the position of the terminal section of the first terminal plate, and protruding externally from the frame section; (3) a frame plate having a through hole corresponding to the through holes of the first and second terminal plates and disposed between one surface of the frame section of the first terminal plate and one surface of the frame section of the second terminal plate; (4) a first cover plate disposed on the other surface of the frame section of the first terminal plate so as to cover the through hole of the first terminal plate; and (5) a second cover plate disposed on the other surface of the frame section of the first terminal plate so as to cover the through hole of the second terminal plate, wherein the sum thickness of the first and second terminal plates and the frame plate accommodates the electrical storage element, and the electric storage element is encapsulated in an internal space formed of the through holes of the frame sections of the first and second terminal plates and the through hole of the frame plate, between both cover plates, and part of the terminal section of the first terminal plate and part of the terminal section of the second terminal plate are exposed externally from the package.