发明名称 Liquid ejecting head and liquid ejecting apparatus
摘要 A liquid ejecting head includes a pressure chamber substrate formed of silicon where a pressure chamber is formed, and a communication plate penetrated by communication holes in a plate thickness direction, in which the pressure chamber partitioned by partition walls formed of crystal orientation planes being formed in the recording head through etching. Acute angle portions are formed, by the partition walls intersecting with each other at an acute angle, in both end portions of the pressure chamber in a first direction, and a first step is disposed in the middle of each of the acute angle portions in an etching direction. Parts of the communication holes are arranged at positions superimposed on the acute angle portions in a bonding surface and remaining parts of the communication holes are arranged on outer sides in the first direction with respect to the acute angle portions such that a second step is formed in a communication portion between the pressure chamber and the communication holes.
申请公布号 US9022529(B2) 申请公布日期 2015.05.05
申请号 US201414300009 申请日期 2014.06.09
申请人 Seiko Epson Corporation 发明人 Takaai Hitoshi;Fukuzawa Yuma;Naganuma Yoichi
分类号 B41J2/05;B41J2/14 主分类号 B41J2/05
代理机构 代理人 Nydegger Workman
主权项 1. A liquid ejecting head comprising: a pressure chamber substrate where a pressure chamber that communicates with a nozzle which ejects a liquid is formed; and a communication plate that is bonded to one surface of the pressure chamber substrate and is penetrated in a plate thickness direction by a communication hole which communicates with an end portion of the pressure chamber in a first direction, wherein acute angle portions are formed, by partition walls intersecting with each other at an acute angle, in both end portions of the pressure chamber in a first direction, wherein a first step is disposed in a middle of each of the acute angle portions in the plate thickness direction, and wherein a second step is formed in a communication portion between the pressure chamber and the communication hole by arranging a part of the communication hole at a position superimposed on the acute angle portion in a bonding surface and arranging a remaining part of the communication hole on an outer side in the first direction with respect to the acute angle portion, wherein the first step includes a plane and the second step includes a plane and wherein the plane of the first step and the plane of the second step are parallel to the bonding surface between the communication plate and the pressure chamber substrate.
地址 Tokyo JP