Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film

摘要

Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film.

主权项

1. A positive photosensitive resin composition, comprising:
(A) an alkali soluble resin, wherein the alkali soluble resin (A) is not a novolac resin; (B) about 1 parts by weight to about 50 parts by weight of a novolac resin including a repeating unit represented by the following Chemical Formula 6; (C) about 5 parts by weight to about 100 parts by weight of a photosensitive diazoquinone compound; (D) about 0.1 parts by weight to about 30 parts by weight of a silane compound; and (E) about 50 parts by weight to about 900 pars by weight of a solvent, each based on about 100 parts by weight of the alkali soluble resin (A): wherein, in Chemical Formula 6, R7 is the same or different in each repeating unit and is each independently a substituted or unsubstituted C1 to C20 aliphatic organic group, wherein about 70 mol % or more of R7 is positioned at a meta position relative to a hydroxy group (OH) based on the total amount 100 mol % of R7 in the repeating unit included in the novolac resin.