发明名称 Solid-state imaging device, camera, and design method for solid-state imaging device
摘要 A solid-state imaging device including two semiconductor substrates arranged in layers is provided. Each semiconductor substrate has a semiconductor region in which a circuit constituting a part of a pixel array is formed. The circuits in the two semiconductor substrates are electrically connected to each other. Each semiconductor substrate includes one or more contact plugs for supplying a voltage to the semiconductor region. The number of the contact plugs of one semiconductor substrate in the pixel array is different from the number of the contact plugs of the other semiconductor substrate in the pixel array.
申请公布号 US9026972(B2) 申请公布日期 2015.05.05
申请号 US201213667880 申请日期 2012.11.02
申请人 Canon Kabushiki Kaisha 发明人 Soda Takehiko
分类号 G06F17/50;H01L27/00;H04N3/14;H04N5/335;H01L27/146 主分类号 G06F17/50
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A solid-state imaging device including a first semiconductor substrate and a second semiconductor substrate arranged in layers, the first semiconductor substrate having a first semiconductor region in which a first circuit constituting a part of a pixel array is formed, the second semiconductor substrate having a second semiconductor region in which a second circuit constituting another part of the pixel array is formed, and the first circuit and the second circuit being electrically connected to each other, wherein the first semiconductor substrate includes one or more first contact plugs for supplying a first voltage to the first semiconductor region and which are electrically connected to an electrically conductive pattern, includes the electrically conductive pattern to which the first voltage is supplied, and includes connection parts that are exposed on a surface of the first semiconductor substrate and that are electrically connected to the electrically conductive pattern, the second semiconductor substrate includes one or more second contact plugs for supplying a second voltage to the second semiconductor region that are electrically connected to the connection parts, wherein the first voltage supplied from the electrically conductive pattern is supplied as the second voltage to the second semiconductor substrate via the second contact plugs, and the number of the first contact plugs in the pixel array is different from the number of the second contact plugs in the pixel array.
地址 Tokyo JP