Abrasive tool for use as a chemical mechanical planarization pad conditioner

摘要

An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

主权项

1. An abrasive tool comprising:
a CMP pad conditioner comprising:
a plate; andan abrasive article comprising:
a solid substrate having a first major surface and a second major surface opposite the first major surface, the substrate further comprising a side surface defining a periphery extending between the first major surface and second major surface, wherein the side surface comprises a flat portion;a first single layer of abrasive grains attached to the first major surface;a second single layer of abrasive grains attached to the second major surface; and wherein the plate and abrasive article are removably coupled via a coupling mechanism configured for reversible operation of the abrasive article.