发明名称 LED light module
摘要 A light emitting module is disclosed. The light emitting module includes a lead frame body, lead frame, a heat spreader, an intermediate heat sink, and at least one light emitting element (LED). The lead frame body defines a cavity which accurately registers the heat spreader and includes optical or reflective walls surrounding the light emitting elements soldered on metallized traces of the heat spreader. The lead frame body encases and supports portions of the lead frame. The lead frame extends from outside the body into the cavity to accurately align with solder pads of the heat spreader. All the pre-aligned mechanical, thermal and electrical contacts are then soldered by solder reflow process under tight environmental control to prevent damage to the light emitting element. A robust, healthy 3-dimensional optical-electro-mechanical assembly having a very low thermal resistance in a thermal path from its light emitting element to its intermediate heatsink is created.
申请公布号 US9024350(B2) 申请公布日期 2015.05.05
申请号 US201113019900 申请日期 2011.02.02
申请人 发明人 Loh Ban P
分类号 H01L33/00;F21V29/00;F21K99/00;F21Y101/02 主分类号 H01L33/00
代理机构 代理人
主权项 1. A light emitting module, the module comprising: a lead frame body, said lead frame body defining a cavity; lead frame wherein first portions of said lead frame are encased within said lead frame body, and said lead frame having second portions; a heat spreader positioned at least partially within the cavity of said lead frame body, said heat spreader connected to said lead frame; at least one light emitting element placed on said heat spreader; and a first snap in body engaging the second portions of said lead frame.
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