发明名称 Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications
摘要 The invention is directed to a polymer thick film conductive composition comprising (a) a conductive silver-coated copper powder; and (b) an organic medium comprising two different resins and organic solvent, wherein the ratio of the weight of the conductive silver-coated copper powder to the total weight of the two different resins is between 5:1 and 45:1.;The invention is further directed to a method of electrode grid and/or bus bar formation on thin-film photovoltaic cells using the composition and to cells formed from the method and the composition.
申请公布号 US9024179(B2) 申请公布日期 2015.05.05
申请号 US201414248918 申请日期 2014.04.09
申请人 E I du Pont de Nemours and Company 发明人 Dorfman Jay Robert
分类号 H01L31/0224;H01B1/22 主分类号 H01L31/0224
代理机构 代理人
主权项 1. A method of forming a conductive grid on a thin-film photovoltaic cell, comprising the steps of: (a) applying to the front-side of said thin-film photovoltaic cell a solderable polymer thick film conductive composition comprising: (i) a conductive silver-coated copper powder; and(ii) an organic medium comprising two different resins and organic solvent,wherein the ratio of the weight of said conductive silver-coated copper powder to the total weight of said two different resins is between 5:1 and 45:1 and said two different resins are a phenoxy resin and a phenolic resin; and (b) drying said composition.
地址 Wilmington DE US