发明名称 |
Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications |
摘要 |
The invention is directed to a polymer thick film conductive composition comprising (a) a conductive silver-coated copper powder; and (b) an organic medium comprising two different resins and organic solvent, wherein the ratio of the weight of the conductive silver-coated copper powder to the total weight of the two different resins is between 5:1 and 45:1.;The invention is further directed to a method of electrode grid and/or bus bar formation on thin-film photovoltaic cells using the composition and to cells formed from the method and the composition. |
申请公布号 |
US9024179(B2) |
申请公布日期 |
2015.05.05 |
申请号 |
US201414248918 |
申请日期 |
2014.04.09 |
申请人 |
E I du Pont de Nemours and Company |
发明人 |
Dorfman Jay Robert |
分类号 |
H01L31/0224;H01B1/22 |
主分类号 |
H01L31/0224 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a conductive grid on a thin-film photovoltaic cell, comprising the steps of:
(a) applying to the front-side of said thin-film photovoltaic cell a solderable polymer thick film conductive composition comprising:
(i) a conductive silver-coated copper powder; and(ii) an organic medium comprising two different resins and organic solvent,wherein the ratio of the weight of said conductive silver-coated copper powder to the total weight of said two different resins is between 5:1 and 45:1 and said two different resins are a phenoxy resin and a phenolic resin; and (b) drying said composition. |
地址 |
Wilmington DE US |