发明名称 Film deposition method
摘要 A film deposition method, in which a film of a reaction product of a first reaction gas, which tends to be adsorbed onto hydroxyl radicals, and a second reaction gas capable of reacting with the first reaction gas is formed on a substrate provided with a concave portion, includes a step of controlling an adsorption distribution of the hydroxyl radicals in a depth direction in the concave portion of the substrate; a step of supplying the first reaction gas on the substrate onto which the hydroxyl radicals are adsorbed; and a step of supplying the second reaction gas on the substrate onto which the first reaction gas is adsorbed.
申请公布号 US9023738(B2) 申请公布日期 2015.05.05
申请号 US201414458319 申请日期 2014.08.13
申请人 Tokyo Electron Limited 发明人 Kato Hitoshi;Tamura Tatsuya;Kumagai Takeshi
分类号 H01L21/00;C23C16/455;H01L21/30;H01L21/02;C23C16/04;C23C16/40;H01L21/762;C23C14/00 主分类号 H01L21/00
代理机构 IPUSA, PLLC 代理人 IPUSA, PLLC
主权项 1. A film deposition method using a film deposition apparatus including a chamber into which a first reaction gas, which tends to be adsorbed onto hydroxyl radicals, and a second reaction gas capable of reacting with the first reaction gas are supplied, and a turntable provided in the chamber, a substrate provided with a concave portion being mounted on the turntable and a film of a reaction product of the first reaction gas and the second reaction gas being formed on the substrate, the method comprising: a step of controlling an adsorption distribution of the hydroxyl radicals in a depth direction in the concave portion of the substrate; a step of supplying the first reaction gas on the substrate onto which the hydroxyl radicals are adsorbed; and a step of supplying the second reaction gas on the substrate onto which the first reaction gas is adsorbed.
地址 Tokyo JP