发明名称 Method of forming a spacer patterning mask
摘要 The present disclosure pertains to a method of forming a spacer patterning mask. The method entails: providing a substrate; depositing, on the substrate, an interface layer, a core film and a first hard mask; patterning the core film and the first hard mask to form strips; depositing a spacer patterning layer to cover the core film and the first hard mask in the intermediate pattern; planarizing the spacer patterning layer by using the first hard mask in the intermediate pattern as a stop layer; etching the planarized spacer patterning layer; dry etching the second hard mask to expose the partially-etched spacer patterning layer; dry etching the exposed spacer patterning layer to form a spacer pattern; and removing the remaining first hard mask and second hard mask and the core film to obtain the final spacer patterning mask.
申请公布号 US9023224(B2) 申请公布日期 2015.05.05
申请号 US201414278538 申请日期 2014.05.15
申请人 Semiconductor Manufacturing International (Shanghai) Corporation 发明人 Wang Xinpeng;Zhang Haiyang
分类号 B44C1/22;C03C15/00;C03C25/48;C23F1/00;H01L21/302;H01L21/461;H01L21/306;H01L21/308 主分类号 B44C1/22
代理机构 Innovation Counsel LLP 代理人 Innovation Counsel LLP
主权项 1. A method of forming a spacer patterning mask, comprising: providing a substrate; depositing, on the substrate, an interface layer, a core film and a first hard mask; patterning the core film and the first hard mask to form strips that include the core film and the first hard mask, wherein a first separation distance between neighboring strips is based on a second separation distance between patterns of the spacer patterning mask; depositing a spacer patterning layer over the core film and the first hard mask; planarizing the spacer patterning layer by using the first hard mask as a stop layer, wherein the planarizing comprises using chemical mechanical polishing (CMP); etching the spacer patterning layer, wherein an amount of etching is determined based on a separation distance and dimensions of patterns in the spacer patterning mask; depositing a second hard mask; dry etching the second hard mask to expose the spacer patterning layer, wherein a third separation distance between sections of the second hard mask has a predefined relation to the second separation distance between patterns of the spacer patterning mask; dry etching the spacer patterning layer to form a spacer pattern; removing the first hard mask and second hard mask; and removing the core film to obtain the spacer patterning mask.
地址 CN