| 发明名称 | Pressure sensor chip | ||
| 摘要 | A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm. | ||
| 申请公布号 | US9021885(B2) | 申请公布日期 | 2015.05.05 |
| 申请号 | US201313800609 | 申请日期 | 2013.03.13 |
| 申请人 | Azbil Corporation | 发明人 | Seto Yuuki;Tokuda Tomohisa |
| 分类号 | G01L13/02;G01L9/06;G01L13/06;G01L9/00 | 主分类号 | G01L13/02 |
| 代理机构 | Troutman Sanders LLP | 代理人 | Troutman Sanders LLP |
| 主权项 | 1. A pressure sensor chip comprising: a sensor diaphragm that outputs a signal in accordance with a pressure differential; and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith, wherein, in the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm. | ||
| 地址 | Tokyo JP | ||