| 摘要 |
The present invention relates to a plating apparatus to not make a scratch on a plating material when plating is complete, so as to not to mutually hot each other while an under-plating material is plated. In addition, plating efficiency is improved since adhesion of an ion is activated in an electrolysis process of the ion existing in a plating solution in a plating process as plating is completed as the plating material is lifted, and the effects of the quality being improved is achieved as plating can be completed with an equal thickness throughout the entire surface of the under-plating material. According to the present invention, the plating apparatus comprises: a housing having an internal space where an upper portion is opened; lifting portions installed to be symmetrical in the internal space of the housing, and lifting the under-plating material by being lifted up in a vertical direction of the housing; and lifting guide portions respectively connected to the lifting portions, and lifting the lifting portion by receiving a driving force from a driving portion. |
