The present invention relates to a semiconductor package and, more specifically, a semiconductor package that can maximize thermal emission efficiency by dispersing heat generated on a semiconductor chip to a substrate. The semiconductor package comprises: a substrate for manufacturing a semiconductor package; a semiconductor chip attached on the substrate; a conductive connection means connecting the semiconductor chip and the substrate; a molding compound resin which envelops semiconductor chip and conductive connection means and is molded on the substrate; and a heat dissipating metal which is attached between the bottom side of the semiconductor chip and the front side of the substrate.
