SAWING APPARATUS OF SEMICONDUCTOR MATERIALS AND SAWING METHOD OF SEMICONDUCTOR MATERIALS

摘要

Disclosed are an apparatus and a method for cutting semiconductor materials capable of reducing the warpage of the semiconductor materials. The apparatus for cutting the semiconductor materials according to an embodiment of the present invention includes: an inlet part which receives the semiconductor materials outputted from a supply device; and a material picker which picks up the semiconductor materials of the inlet part and transfers the semiconductor materials to a cutting unit to cut the semiconductor materials by an individual unit. The inlet part includes a heating unit which heats the semiconductor materials. Therefore, the semiconductor materials are stably absorbed and fixed in the cutting unit by reducing the warpage of the semiconductor materials.