发明名称 |
HIGH TEMPERATURE MULTILAYER FLEXIBLE PRINTED WIRING BOARD |
摘要 |
<p>In various embodiments, high temperature printed circuit boards are disclosed. In one embodiment, a high temperature printed circuit board (PCB) comprises a first reinforced pre-impregnated layer and a second reinforced pre-impregnated layer. The first reinforced pre-impregnated layer and the second reinforced pre-impregnated layer comprise a plurality of glass fibers having a warp and a weft and impregnated with a polyimide high-temperature resin adhesive. A flexible metal-clad polyimide laminate material is located between the first reinforced pre-impregnated layer and the reinforced second pre-impregnated layer. The flexible metal-clad polyimide laminate material comprises a plurality of conductive traces. A polyimide film is disposed over the first pre-impregnated layer and the second pre-impregnated layer.</p> |
申请公布号 |
CA2869078(A1) |
申请公布日期 |
2015.05.04 |
申请号 |
CA20142869078 |
申请日期 |
2014.10.30 |
申请人 |
TELEDYNE TECHNOLOGIES INCORPORATED |
发明人 |
NELSON, ROBERT A.;DUBOIS, RAYMOND L.;COLLIER, MICHAEL A.;KEATING, JAMES E. |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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