ALUMINIUM ALLOY COPPER ALLOY BOND AND BONDING METHOD FOR SAME

摘要

The present invention provides an aluminium alloy copper alloy bond and a method for same the bond being bonded by means of a novel aluminium alloy copper alloy bonding method which exhibits excellent bonding properties little material deformation during bonding and excellent reliability. A bond in which one member to be bonded is an aluminium alloy an other member to be bonded is a copper alloy and the one member to be bonded and the other member to be bonded are metallic bonded wherein: the one member to be bonded is an aluminium alloy including 3.0 8.0 mass% Cu and 0.1 10 mass% Si with the remainder being Al and unavoidable impurities and satisfies C+2.4xS=7.8 where C (mass%) is the Cu concentration and S (mass%) is the Si concentration; and the other member to be bonded is a copper alloy having a higher solidus temperature than the one member to be bonded.