| 摘要 |
<p>The method comprises: heating a to-be treated part (14) under vacuum or in an inert gas atmosphere by an radiation (6) emitted by a laser (4); measuring a first temperature of the to-be treated part using a pyrometer (24) to control the power provided by the laser; and measuring a second temperature of the part using a thermocouple (28), and correcting the first measurements by the second measurements. An independent claim is included for a device for heat treating a thin machine element i.e. thin aeronautical part.</p> |
