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发明名称
加工装置
摘要
本发明的课题为提供一种可以不浪费地加工晶柱(ingot)等被加工物的加工装置。解决手段为做成具备下述机构之构成:具有将被加工物保持成可旋转之保持面的保持机构、具有雷射光束产生机构与将雷射光束产生机构所产生的雷射光束(laser beam)聚光在保持机构所保持的被加工物内部之聚光机构的雷射光束照射机构、使保持机构与雷射光束照射机构在保持机构的保持面方向上相对移动的相对移动机构、将对保持机构所保持的被加工物照射雷射光束而在被加工物内部形成的改质面作为分界,以将被加工物的一部分剥离的剥离机构,以及具有将保持机构所保持之被加工物的改质面侧磨削或研磨的加工砂轮与供加工砂轮装设并使加工砂轮旋转之主轴(spindle)的加工机构。
申请公布号
TW201515752
申请公布日期
2015.05.01
申请号
TW103123327
申请日期
2014.07.07
申请人
迪思科股份有限公司 DISCO CORPORATION
发明人
梅田桂男 UMEDA, YOSHIO;小林贤史 KOBAYASHI, SATOSHI;汤平泰吉 YUBIRA, YASUYOSHI
分类号
B23K26/36(2014.01);B24B9/02(2006.01)
主分类号
B23K26/36(2014.01)
代理机构
代理人
恽轶群陈文郎
主权项
地址
日本 JP
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