SUBSTRATE FOR POWER MODULE SUBSTRATE FOR POWER MODULE WITH HEAT SINK POWER MODULE AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE

摘要

In this substrate for a power module a circuit layer (12) includes an aluminum layer (12A) arranged on one face of an insulating layer (11) and a copper layer (12B) laminated to one side of the aluminum layer (12A) the aluminum layer (12A) and the copper layer (12B) being bonded by solid phase diffusion.