串联式沉积控制设备及串联式沉积控制之方法;INLINE DEPOSITION CONTROL APPARATUS AND METHOD OF INLINE DEPOSITION CONTROL

摘要

一种串联式沉积控制设备，用于具有一或数个沉积源之一真空沉积设备，此或此些沉积源用以沉积一或数个沉积层于一基板上，串联式沉积控制设备包括一或数个光源，适用于照亮具有沉积层之基板；一侦测配置，适用于一量测讯号之光谱解析侦测，其中量测讯号选自在具有沉积层之基板反射之光，以及穿透具有沉积层之基板之光的至少一者；一评估单元，用以基于量测讯号决定沉积层的各自的厚度；以及一控制器，连接于评估单元且可连接于真空沉积设备，控制器用以基于决定之厚度回馈控制沉积层之沉积。再者，提供一种串联式沉积控制之方法。; a detection arrangement adapted for spectrally resolved detection of a measurement signal, wherein the measurement signal is selected from at least one of: light reflected at the substrate having the one or more deposition layers, and light transmitted through the substrate having the one or more deposition layers; an evaluation unit to determine the respective thicknesses of the one or more layers based on the measurement signal; and a controller connected to the evaluation unit and connectable to the vacuum deposition apparatus for feed-back control of the deposition of the one or more deposition layers based on the determined thicknesses. Furthermore, a method of inline deposition control is provided.