发明名称 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern |
摘要 |
A semiconductor device has a substrate. A conductive via is formed through the substrate. A plurality of first contact pads is formed over a first surface of the substrate. A plurality of second contact pads is formed over a second surface of the substrate. A dummy pattern is formed over the second surface of the substrate. An indentation is formed in a sidewall of the substrate. An opening is formed through the substrate. An encapsulant is deposited in the opening. An insulating layer is formed over second surface of the substrate. A dummy opening is formed in the insulating layer. A semiconductor die is disposed adjacent to the substrate. An encapsulant is deposited over the semiconductor die and substrate. The first surface of the substrate includes a width that is greater than a width of the second surface of the substrate. |
申请公布号 |
US2015115465(A1) |
申请公布日期 |
2015.04.30 |
申请号 |
US201414329464 |
申请日期 |
2014.07.11 |
申请人 |
STATS ChipPAC, Ltd. |
发明人 |
Lin Yaojian;Chen Kang;Goh Hin Hwa;Shim Il Kwon |
分类号 |
H01L23/538;H01L23/00;H01L23/31 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of making a semiconductor device, comprising:
providing a substrate; forming a plurality of first contact pads over a first surface of the substrate; forming a plurality of second contact pads over a second surface of the substrate; and forming a dummy pattern over the second surface of the substrate. |
地址 |
Singapore SG |