| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for wafer level lens that is superior in hardenability and can reduce a residual object originated in a photosensitive resin outside a formation region of a shading film, and to provide a titanium black dispersion for wafer level lens used for the photosensitive resin composition, and a wafer level lens with a shading film formed by using the photosensitive resin composition. <P>SOLUTION: The titanium black dispersion for wafer level lens contains: (A) titanium black particles; (B) a dispersion agent; and (C) an organic solvent, wherein an object to be dispersed containing the (A) titanium black particles contains Si atoms, and the content ratio (Si/Ti) of Si atoms and Ti atoms in the object to be dispersed is 0.05 or more. The photosensitive resin composition for wafer level lens contains the titanium black dispersion, (D) a photopolymerizable compound, and (E) a photopolymerizable initiator. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
