| 摘要 |
<p>An electronic device and fabrication method thereof are provided. The electronic device contains a glass substrate (100), a patterned semiconductor substrate (108), having at least one opening (122,124), disposed on the glass substrate and at least one passive component (200A,200B) having a first conductive layer (104a,104b) and a second conductive layer (112a-c), wherein the first conductive layer is disposed between the patterned semiconductor substrate and the glass substrate.</p> |
