| 摘要 |
<p>Provided is a technology that can produce a module provided with an inter-layer connection conductor at a low cost and with a short production time by means of mounting a terminal assembly, to which a plurality of connection terminals are joined via a joining section, onto a wiring substrate, sealing with resin, and then eliminating the joining section. When producing the module (100) resulting from mounting and resin sealing an electronic component (102) and a connection terminal (11) forming an inter-layer connection conductor onto a wiring substrate (101), a terminal assembly (10) resulting from one end of a plurality of connection terminals (11) being connected with a joining section (12) therebetween by means of machining a metal plate is prepared, the electronic component (102) and the terminal assembly (10) are mounted to one primary surface of the wiring substrate (101) (first mounting step), the electronic component (102) and the connection terminals (11) are sealed by a resin layer (103) (first sealing step), and then the joining section (12) is eliminated (elimination step). As a result, it is possible to produce a module (100) provided with an inter-layer connection conductor at a low cost and a short production time.</p> |
