| 摘要 |
According to a first aspect there is provided a light emitting diode (LED) package. The LED package comprises a conductive layer disposed on a non-conductive substrate, a plurality of high aspect ratio cavities extending through the conductive layer thereby separating the conductive layer into a plurality of electrical tracks,and one or more LED die mounted on to an exposed surface of the conductive layer, each of the one or more LED die having a first electrode in electrical contact with one of the electrical tracks. |
