METHODS AND SYSTEMS FOR INSERTION OF SPARE WIRING STRUCTURES FOR IMPROVED ENGINEERING CHANGE ORDERS

摘要

A method for insertion of spare wiring structures into an integrated circuit comprises determining an architecture of spare wiring structures upon which to base the insertion of spare wiring structures, inserting spare wiring structures into a physical design of the integrated circuit according to the determined architecture, and outputting an engineering-change-order-ready integrated circuit layout. The determined architecture depends upon a design characteristic or design characteristic value. The spare wiring structures include a plurality of spare electrically conductive interconnect layer structures disposed on at least one of a plurality of interconnect layers, which are disposed on one or both sides of a substrate including a plurality of electronic devices. The plurality of interconnect layers include at least one horizontal interconnect layer and at least one vertical- interconnect-access (VIA) layer. The plurality of spare electrically conductive interconnect layer structures are electrically isolated from a plurality of active electrically conductive interconnect layer structures.