发明名称 HEAT DISSIPATION FILM, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide an inexpensive heat dissipation film high in thermal conductivity and excellent in breaking fracture resistance.SOLUTION: The method for manufacturing a heat dissipation film having a heat transfer layer formed by uniformly dispersing graphene fine particles and carbon nanotubes comprises: (1) sandwiching a mixture layer having 0.05-0.2 of a ratio of the mass of the carbon nanotubes and 0.01-0.1 of a ratio of the mass of a binder resin to the total mass of the graphene fine particles and the carbon nanotubes by a pair of first plastic films to form a laminated film; (2) densifying the mixture layer by heat-pressing the laminated film; (3) burning the mixture layer exposed by peeling a first plastic film; (4) forming a heat transfer layer densified by pressing the obtained burned layer; and (5) covering the heat transfer layer with a second plastic film or an insulating resin.</p>
申请公布号 JP2015084359(A) 申请公布日期 2015.04.30
申请号 JP20130222128 申请日期 2013.10.25
申请人 KAGAWA SEIJI 发明人 KAGAWA SEIJI
分类号 H01L23/373;B32B7/02;B32B9/00;B32B27/18;B32B37/10;B82Y30/00;B82Y40/00;C01B31/02;C08J7/04 主分类号 H01L23/373
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