INSPECTION DEVICE

摘要

PROBLEM TO BE SOLVED: To solve problems with a conventional technique that an inspection device may obtain a fault size and more desirably a fault shape in addition to the fault size since to obtain the fault shape can contribute to prompt identification of a cause of an abnormality in semiconductor manufacturing process but that the conventional technique pays attention to this respect only insufficiently.SOLUTION: According to the present invention, a first signal waveform is obtained from a first detection optical system, and a second signal waveform is obtained from a second detection optical system arranged at a spatially different position from that of the first detection optical system; and dimensions of a fault in a first direction and dimensions of the fault in a second direction crossing the first direction are obtained from the first signal waveform and the second signal waveform.