| 发明名称 |
CROSS SECTION PROCESSING METHOD AND CROSS SECTION PROCESSING APPARATUS |
| 摘要 |
A cross section processing method and a cross section processing apparatus are provided in which it is possible to form a flat cross section in a sample composed of a plurality of substances having different hardness by a focused ion beam. The etching of a processing area is performed while variably controlling the irradiation interval, the irradiation time, or the like of a focused ion beam based on cross section information of an SEM image obtained by the observation of a cross section. In this way, even if a sample is composed of a plurality of substances having different hardness, it is possible to form a flat observation surface with a uniform etching rate. |
| 申请公布号 |
US2015115156(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414520595 |
申请日期 |
2014.10.22 |
| 申请人 |
HITACHI HIGH-TECH SCIENCE CORPORATION |
发明人 |
SUZUKI Hidekazu;ASAHATA Tatsuya;UEMOTO Atsushi |
| 分类号 |
H01J37/26;H01J37/305;H01J37/22;H01J37/244;H01J37/28 |
主分类号 |
H01J37/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cross section processing method of performing processing of a cross section of a sample by irradiating the sample with a focused ion beam, the method comprising:
a cross section information obtaining process of obtaining cross section information of the sample; and a cross section processing process of forming an observation surface of the sample by performing etching of the cross section by irradiating the sample with the focused ion beam while varying an irradiation amount of the focused ion beam based on the obtained cross section information. |
| 地址 |
Tokyo JP |
