Method for Welding at Least Two Layers

摘要

The method of the invention relates to a method for welding a first (20) and a second (30) layers together. The second melting temperature of the second layer (30), Tm,2, is lower than the first melting temperature of the first layer (20), Tm,1. After having formed a layup (50) by placing the first layer (20) on top of the second layer (30), a rotating tool (70) is pressed and translated over at least a friction portion (15) of the upper surface (20u) of the first layer (20) such that the temperature reached by at least a portion of the upper surface (30u) of the second layer (30) is higher than the second melting temperature, Tm,2. Restraining means allow preventing molten second material from flowing out of the layup (50). Materials of first (20) and second (30) layers are chosen among the following materials: metals, semi-metals, or semiconductors.

主权项

1. Method for welding at least two layers together over at least a first joint surface and comprising the steps of:
(a) providing a first layer of a first material having a first melting temperature, Tm,1, said first layer having an upper surface and a lower surface separated by the thickness t1 of the first layer; (b) providing a second layer of a second material having a second melting temperature, Tm,2, lower than the first melting temperature, Tm,1, said second layer having an upper surface and a lower surface separated by the thickness t2 of the second layer; (c) forming a layup by stacking the first and second layers such that the lower surface of the first layer contacts and at least partially overlaps the upper surface of the second layer forming an interface; (d) pressing and translating over at least one friction portion of the upper surface of the first layer wherein the portion of the interface which is in registry with the friction portion defines the first joint surface, a rotating tool to raise the temperature of said at least one friction portion of the upper surface of the first layer by friction and to conduct heat through the thickness t1 of the first layer to the second layer such that the temperature reached by at least a portion of the upper surface of the second layer that is comprised in said first joint surface is higher than the second melting temperature Tm,2; (e) providing restraining means for preventing molten second material from flowing out of the layup; wherein said first and second materials of said first and second layers are chosen among the following materials:metals, semi-metals or semiconductors.