| 摘要 |
<p>The present invention relates to a chip electronic component and a manufacturing method thereof. The chip electronic component includes: a magnet body having a coil conductive pattern part; and an oxidation insulating layer formed on the surface of the coil conductive pattern part. According to a chip electronic component and a manufacturing method thereof according to an embodiment of the present invention, the exposure of the coil conductive pattern part can be prevented while forming a thinner insulating layer compared to an existing insulating layer and allowing a magnetic material to indirectly touch the coil conductive pattern part. Thereby, the waveform error in a high frequency wave can be prevented.</p> |
