| 摘要 |
PROBLEM TO BE SOLVED: To provide a Bi-based solder alloy which does not substantially contain Pb, has a solidus temperature of 265°C or more and a liquidus temperature of 390°C or less, is excellent in machinability, mechanical strength and bonding reliability and is suitable for bonding electronic parts onto a bare Cu frame substrate.SOLUTION: A Bi-based solder alloy contains Ag and Al, does not substantially contain Pb, has a Bi content of 80 mass% or more and has a melting point solidus of 265°C or more and a liquidus of 390°C or less. Therein, the Ag content is 0.6 to 18 mass%, the Al content is 0.1 to 3 mass% and is 1/20 to 1/2 of the Ag content, particles which contain an intermetallic compound of Ag and Al are dispersed in the solder alloy and, further, at least one kind of P and Ge is contained by 0.001 to 0.3 mass%. |
