| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component excellent in a releasing property of heat generated in an electronic device.SOLUTION: There is provided an electronic component including an electronic device and a container that accommodates the electronic device, where the container includes a substrate that has a first area to which the electronic device is fixed and a second area on the periphery of the first area, a lid body that is arranged opposite to the electronic device across a space, and a frame body that is fixed to the second area to surround the space. The frame body includes a first member and a second member having lower thermal conductivity than that of the first member and substrate, where the first member includes a first part that is located on the inner edge side of the frame body with respect to the outer edge of the substrate in a direction toward the outer edge of the frame body from the inner edge of the frame body, and a second part that is located on the outer edge side of the frame body with respect to the outer edge of the substrate. The second member is located between the lid body and the first member, and the shortest distance between the first member and the substrate is smaller than the shortest distance between the first member and the lid body. |
