发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate processing device which allows for uniform processing of a substrate in the in-plane thereof by using light emission of plasma, and to provide a substrate processing method.SOLUTION: A light-emitting panel 5, as a light irradiation unit, internally has a plurality of discharge cells 40, a long discharge electrode 47 provided corresponding to the discharge cells 40, respectively, and a plurality of long address electrodes 53 provided in a direction orthogonal to the discharge electrode 47. Interior of each discharge cell 40 is a plasma generation space for generating plasma. The light-emitting panel 5 generates the ultraviolet rays by a plasma generated in the discharge cell 40, and the processing space S1 in a processing container 1 is irradiated with the ultraviolet rays.</p>
申请公布号 JP2015084387(A) 申请公布日期 2015.04.30
申请号 JP20130222612 申请日期 2013.10.25
申请人 TOKYO ELECTRON LTD 发明人 IIZUKA YASHIRO
分类号 H01L21/205;C23C16/48;H01L21/31;H01L21/318 主分类号 H01L21/205
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