| 摘要 |
Provided are a bonding method and device that are capable of preventing the destruction of a layer that has low toughness when bonding a film containing the layer with low toughness on a bonding object. A bonding object and a film containing a layer with a lower toughness than the bonding object are placed between a set of pressing dies, which have pressing surfaces that are disposed facing each other and in which open holes are formed in the pressing surfaces. In the set of pressing dies, the first edges of the open holes on the pressing surface of the first pressing die, which faces the film, are located further towards the inside of the open holes than the second edges of the open holes on the pressing surface of the second pressing die, which faces the bonding object. By sandwiching and pressing the bonding object and the film using the set of pressing dies, the portion of the film to be pressed by the set of pressing dies is bonded to the bonding object. |
