PICKUP DEVICE AND PUSH-UP POT

摘要

The present description discloses a pickup device provided with a push-up pot for pushing up a semiconductor chip stuck onto the upper surface of a film from below. In the pickup device, an identification mark is put on a side surface portion of the push-up pot. The present description also discloses a push-up pot used for pushing up a semiconductor chip stuck onto the upper surface of a film from below in a pickup device. In the push-up pot, an identification mark is put on a side surface portion.