| 摘要 |
<p>In the disclosed fixed die (41), which is a first die, a thermal leveling member (83) is provided that is disposed between a mounting plate (72) and an insulating plate (82), and that has a high thermal conductivity compared to a template (71), the mounting plate (72), and the insulating plate (82); consequently, the thermal leveling member (83) suppresses the effect on the mounting plate (72) and the like of a temperature differential arising in the insulating plate (82). In other words, during molding injection or cooling, even if a temperature distribution arises in the very same insulating plate (82) that prevents the flow of heat to a fixed plate (11) that is a supporting foundation, the effect from the insulating plate (82) on the mounting plate (72) and the like is reduced. As a result, the template (71) and mounting plate (72) are cooled relatively evenly, the temperature distribution of the inner surface (71i) of the template during cooling after resin injection is reduced, and a resin molded article having high optical performance can be molded with favorable yield.</p> |
