发明名称 DYNAMIC HEADPHONES
摘要 Provided is a dynamic headphone that has a small size but makes a larger-diameter headphone unit mountable thereon, the dynamic headphone including a highly reliable acoustic channel that acoustically connects a front air chamber and a back air chamber to each other. A headphone case 20 houses a headphone unit 50 therein, and includes a back air chamber C2 on a back side of the headphone unit 50. The headphone case 20 includes: a back air chamber forming portion 40 that forms the back air chamber C2; and a mount portion 30 integrally provided to an opening end of the back air chamber forming portion 40, the headphone unit 50 being mounted in the mount portion 30. An acoustic channel 70 is provided between the mount portion 30 and the headphone unit 50.
申请公布号 US2015117693(A1) 申请公布日期 2015.04.30
申请号 US201414336374 申请日期 2014.07.21
申请人 KABUSHIKI KAISHA AUDIO-TECHNICA 发明人 AKINO Hiroshi
分类号 H04R1/10 主分类号 H04R1/10
代理机构 代理人
主权项 1. A dynamic headphone comprising: a headphone unit including: a diaphragm including a voice coil; a magnetic circuit portion including a magnetic gap in which the voice coil is placed; and a unit frame that supports the diaphragm and the magnetic circuit portion; a headphone case that houses the headphone unit therein while securing a back air chamber having a predetermined volume on a back side of the headphone unit; an ear pad that is provided to an outer peripheral edge part of the headphone case so as to: surround an ear on a sound emitting surface side of the headphone unit; and form a front air chamber having a predetermined volume on a front side of the headphone unit, when the dynamic headphone is fitted to a head side part of a human body; and an acoustic channel that acoustically connects the front air chamber and the back air chamber to each other, wherein the headphone case includes: a back air chamber forming portion that forms the back air chamber; and a mount portion integrally provided to an opening end of the back air chamber forming portion, the headphone unit being mounted in the mount portion, and the acoustic channel is provided between the mount portion and the headphone unit.
地址 Tokyo JP