| 发明名称 |
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor structure includes a semiconductor substrate and a pad. The pad is on a top surface of the semiconductor substrate. The semiconductor structure further includes a circuit board and a bump. The circuit board has a contact area corresponding to the pad on the top surface of the semiconductor substrate, and the bump is between the pad on the top surface of the semiconductor substrate and the contact area, wherein the contact area is a non-metallic surface. |
| 申请公布号 |
US2015115441(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201314063302 |
申请日期 |
2013.10.25 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
LU CHUN-LIN;WU KAI-CHIANG |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor structure, comprising:
a semiconductor substrate; a pad on a top surface of the semiconductor substrate; a circuit board including a contact area corresponding to the pad on the top surface of the semiconductor substrate; and a bump between the pad on the top surface of the semiconductor substrate and the contact area, wherein the contact area is a non-metallic surface. |
| 地址 |
Hsinchu TW |
