| 摘要 |
The objective of the present invention is to facilitate maintenance of a flow tank. A sub-module (12) is provided adjacent to a main module (10). A substrate is conveyed to the sub-module (12), is heated by a heater (352) that is at a heating position, is moved to the main module (10), and in parallel with insertion of a component by a component insertion apparatus (22), solder is attached by a flow tank (206), thereby mounting the component. When a condition for maintenance is met, conveyance of substrates is discontinued, the heater (352) is moved to a standby position, and the flow tank (206) is moved to a maintenance position in the sub-module (12). Maintenance is performed for the flow tank (206); however, the component insertion apparatus (22) is not present above the flow tank (206), and therefore, it is possible to easily perform inspection, removal, and the like of the flow tank (206). |
