发明名称 SURFACE TREATMENT DEVICE OF SUBSTRATE MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To provide a surface treatment device of a substrate material, capable of improving processing accuracy, such as improvement of uniformity and preventing the variation of circuit width from being generated and advantageously achieved in a cost.SOLUTION: A surface treatment device 1 is formed by combining various kinds of arrangement position settings, etc., of the spray nozzles 5. The spray nozzles 5 uniformly treat a substrate material A by treatment liquids injected from the spray nozzles 5 on the basis of the combination of: setting of a positional relationship sequentially laterally shifted by a lateral shift interval K without forming a row before/after by an interval between the spray nozzles located before/after; setting of a vertical interval between the spray nozzle 5 and the substrate material A; and setting of a lateral pitch interval N between the spray nozzles 5 on the basis on the setting of the vertical interval. The lateral shift interval K is 5-25 mm, the vertical interval is 30-150 mm, especially 50-100 mm, and the lateral pitch interval N is 30-120 mm.</p>
申请公布号 JP2015084407(A) 申请公布日期 2015.04.30
申请号 JP20140160228 申请日期 2014.08.06
申请人 AIKEI KK 发明人 KIYOKAWA YOSHIFUMI;HAYASHI TOSHIO;TSUBOI KOICHI
分类号 H05K3/06 主分类号 H05K3/06
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