发明名称 SUBSTRATE STRUCTURE AND PRINTED CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate structure which allows printed circuit boards to be bonded with each other more simply and more tightly while preventing unnecessary stress from occurring when two printed circuit boards are bonded.SOLUTION: A substrate structure 10 comprises: a first printed circuit board 11 having at least one first through hole 18; and a second printed circuit board 21 having a first projection 29 inserted in the first through hole. The first through hole 18 has a first region having a first width and a second region having a second width larger than the first width. The first projection and the first region fit each other and the first projection and the second region freely fit each other.</p>
申请公布号 JP2015084368(A) 申请公布日期 2015.04.30
申请号 JP20130222357 申请日期 2013.10.25
申请人 OKI ELECTRIC IND CO LTD 发明人 KITAI ATSUSHI;SAITO KENICHI
分类号 H05K1/14 主分类号 H05K1/14
代理机构 代理人
主权项
地址