| 发明名称 |
SEMICONDUCTOR MODULE |
| 摘要 |
A power module includes: a base plate having a front surface provided with positioning wire bonding portions; an insulating substrate provided with hole portions accommodating the positioning wire bonding portions on a side of a back surface facing the base plate, and fixed to the base plate with being positioned with respect to the base plate by the hole portions accommodating the positioning wire bonding portions; and a semiconductor chip arranged on a side of a front surface of the insulating substrate opposite to the back surface. |
| 申请公布号 |
US2015115478(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414328112 |
申请日期 |
2014.07.10 |
| 申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
OTSUKI Takami;YONEYAMA Rei;YAMASHITA Akihiko;KIMURA Yoshitaka |
| 分类号 |
H01L23/544;H01L23/12;H01L23/00 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor module, comprising:
a base plate having a front surface provided with a positioning wire bonding portion; an insulating substrate provided with a receiving portion accommodating said positioning wire bonding portion on a side of a back surface facing said base plate, and fixed to said base plate with being positioned with respect to said base plate by said receiving portion accommodating said positioning wire bonding portion; and a semiconductor chip arranged on a side of a front surface of said insulating substrate opposite to said back surface. |
| 地址 |
Tokyo JP |
