| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of integrating a device and an integrated device.SOLUTION: A substrate 10 has an upper surface having surface flatness, and preferably has a relatively smooth and flat surface. A desired smoothness and flatness of the upper surface may be achieved through polishing. On a surface, a film 12 having a film thickness greater than the surface non-planarity of the surface is deposited. The upper surface 13 of the film is then polished to a planar surface with a roughness of 5-15 Å and preferably 5-10 Å. A film 17 having a surface 18 is formed on a substrate 16 with a method similar to that used for the case of the substrate 10. The surfaces 18 and 13 are brought into contact with each other. A bond, such as a Van der Waals bond, is formed between the surfaces 18 and 13. A stronger bond can be achieved by heating the joined substrates and films. |
