| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device which can productively bond a lid member to an element mounting member without using heat. <P>SOLUTION: The method for manufacturing an electronic device includes: an electronic component element mounting step of mounting an electronic component element on the element mounting member having an annular sealing frame portion formed along an edge portion of one main surface; a lid member location step of locating the lid member in a first pressing jig having a recessed space and having an annular projecting portion along an edge portion of a bottom surface of the recessed space such that the lid member is in contact with the projecting portion; an element mounting member location step of locating the element mounting member in a position where the sealing frame portion is opposite to the projecting portion with the lid member in between; and a sealing step of placing a second jig into contact with the other main surface of the element mounting member and applying to the second jig a pressure parallel to a direction from an opening of the recessed space to the bottom surface, so that part of the lid member deformed by the projecting portion is pressed into the sealing frame portion of the element mounting member to bond the lid member to the element mounting member and hermetically seal the electronic component element. <P>COPYRIGHT: (C)2012,JPO&INPIT |
