電子部品の実装構造,申请号JP20120221792-传众专利搜索

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发明名称	電子部品の実装構造
摘要
申请公布号	JP5711195(B2)	申请公布日期	2015.04.30
申请号	JP20120221792	申请日期	2012.10.04
申请人		发明人
分类号	H01R33/76;H01L23/32;H01R11/01	主分类号	H01R33/76
代理机构		代理人
主权项
地址

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