| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polysiloxane-based composition having high heat resistance and light resistance, excellent in gas barrier property and thermal shock resistance, and also having good handling ability in a sealing process for optical semiconductor elements. <P>SOLUTION: The modified polyhedral polysiloxane body is obtained by performing hydrosililation reaction of a polysiloxane compound (b) obtained by performing mutual hydrosililation reaction of a polyhedral polysiloxane-based compound (a) containing an alkenyl group and hydrosilyl group, a compound (c) having at least two hydrosilyl groups or alkenyl groups in one molecule, and an organosilicon compound (d) having at least one hydrosilyl group or alkenyl group in one molecule. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
