发明名称 リードフレーム、半導体装置及び製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a lead frame, a semiconductor device, and a manufacturing method capable of appropriately selecting an application range of a primer. <P>SOLUTION: A lead frame 1 according to the present invention is a lead frame 1 comprising external terminals 2, 6 extending in a predetermined extension direction. The lead frame 1 comprises tapering members 4, 8, in which dimensions in a thickness direction of the lead frame 1 on a vertical line vertical to the extension direction taper down toward a cross section between the vertical line and a profile line viewed from the thickness direction. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5710406(B2) 申请公布日期 2015.04.30
申请号 JP20110154919 申请日期 2011.07.13
申请人 发明人
分类号 H01L23/50 主分类号 H01L23/50
代理机构 代理人
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