发明名称 シリコンエピタキシャルウェーハ及びシリコンエピタキシャルウェーハの製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a silicon epitaxial wafer that effectively keeps misfit dislocation from being generated when growing a silicon epitaxial layer on a silicon monocrystalline substrate having resistivity of 20[mΩcm] or less, which is liable to cause misfit dislocation, to provide a method of manufacturing the same, and to provide an epitaxially growing silicon monocrystalline substrate. <P>SOLUTION: The silicon epitaxial wafer has a silicon epitaxial layer formed on a silicon monocrystalline substrate, wherein the silicon monocrystalline substrate is one to which at least both boron and gallium are added as a doping agent, and its resistivity is≤20 [mΩcm]. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP5710104(B2) 申请公布日期 2015.04.30
申请号 JP20090016864 申请日期 2009.01.28
申请人 发明人
分类号 H01L21/20;C23C16/24;H01L21/205 主分类号 H01L21/20
代理机构 代理人
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